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Patent Searching and Data


Title:
THERMAL INTERFACE MATERIAL AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/119756
Kind Code:
A1
Abstract:
Disclosed in the present invention are a thermal interface material and a preparation method therefor. The preparation method for the thermal interface material comprises the steps: S1. stirring and uniformly mixing spherical boron nitride, a thermosetting resin, a curing agent, a catalyst, and a coupling agent to acquire a mixed slurry; and S2. heat-curing the mixed slurry to obtain a thermal interface material. Also disclosed in the present invention is a thermal interface material, comprising a polymer matrix and spherical boron nitride uniformly filling the polymer matrix. In the present invention, spherical boron nitride is used to fill the resin, increasing the amount of boron nitride filling the resin, and thereby increasing the thermal conductivity coefficient of the thermal interface material; in addition, the viscosity of the thermal interface material is reduced, increasing the operability of the thermal interface material. The preparation method of the present invention is simple and easy to implement, the cost of the raw materials is low, and the prepared thermal interface material has a high thermal conductivity coefficient and can be used in the field of heat dissipation for high-density electronic devices.

Inventors:
SUN RONG (CN)
REN LINLIN (CN)
ZENG XIAOLIANG (CN)
XU JIANBIN (CN)
WONG CHINGPING (CN)
Application Number:
PCT/CN2019/124829
Publication Date:
June 18, 2020
Filing Date:
December 12, 2019
Export Citation:
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Assignee:
SHENZHEN INST OF ADV TECH CAS (CN)
International Classes:
C08L63/00; C08K3/38; C08K7/18; C09K5/14
Foreign References:
CN109651761A2019-04-19
CN106519581A2017-03-22
CN101035876A2007-09-12
US20180230290A12018-08-16
CN107805473A2018-03-16
CN106044727A2016-10-26
CN106700427A2017-05-24
Attorney, Agent or Firm:
MING & YUE INTELLECTUAL PROPERTY LAW FIRM (CN)
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