Title:
THERMAL OVERLOAD RELAY
Document Type and Number:
WIPO Patent Application WO/2023/276487
Kind Code:
A1
Abstract:
In a case (12), an engagement hole (21) is formed in a side surface in a width direction. On a cover (13), a protruding piece (22) protruding to the case (12) side is formed, and a leading end (23) of the protruding piece (22) is fitted to the engagement hole (21) from the inside. In a reset bar (34), a recessed portion (55) is formed in a predetermined range of an outer peripheral surface in a depth direction and a circumferential direction, and when in either an initial position or an automatic reset position, the reset bar prevents the leading end (23) from being pushed inward by the outer peripheral surface facing the reverse side of the protruding piece (22). When in a manual reset position, the reset bar permits the leading end (23) to be pushed inward by the recessed portion (55) facing the reverse side of the protruding piece (22).
Inventors:
KAMOSAKI TAKEO (JP)
ONOGI YUMA (JP)
MIURA HAYATO (JP)
ONOGI YUMA (JP)
MIURA HAYATO (JP)
Application Number:
PCT/JP2022/021039
Publication Date:
January 05, 2023
Filing Date:
May 23, 2022
Export Citation:
Assignee:
FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD (JP)
International Classes:
H01H61/01
Foreign References:
| JP2012146400A | 2012-08-02 | |||
| JP2014107023A | 2014-06-09 |
Other References:
See also references of EP 4195234A4
Attorney, Agent or Firm:
HIROSE Hajime et al. (JP)
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