Title:
THERMAL PRINTHEAD, THERMAL PRINTER, AND METHOD FOR PRODUCING THERMAL PRINTHEAD
Document Type and Number:
WIPO Patent Application WO/2024/004658
Kind Code:
A1
Abstract:
This thermal printhead comprises a substrate, a wiring layer and a resistor layer, a protective layer, a driver IC, and a filling resin layer having a portion interposed between a main surface and the driver IC, wherein the wiring layer comprises Ag and has a plurality of first pads, the driver IC has a plurality of electrodes, the protective layer has openings where the plurality of electrodes are exposed, the plurality of electrodes are electrically connected to the plurality of first pads through the openings, and the filling resin layer fills all of the openings.
Inventors:
WATANABE TOSHIO (JP)
Application Number:
PCT/JP2023/022118
Publication Date:
January 04, 2024
Filing Date:
June 14, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
B41J2/335
Domestic Patent References:
| WO2012133178A1 | 2012-10-04 |
Foreign References:
| JP2016185675A | 2016-10-27 | |||
| JP2018167439A | 2018-11-01 | |||
| JP2019147300A | 2019-09-05 | |||
| JPS6294846U | 1987-06-17 | |||
| JPH09207366A | 1997-08-12 | |||
| JP2017114050A | 2017-06-29 | |||
| JP2015193110A | 2015-11-05 | |||
| US5570123A | 1996-10-29 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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