Title:
THERMAL PRINTHEAD
Document Type and Number:
WIPO Patent Application WO/2024/014066
Kind Code:
A1
Abstract:
A thermal printhead (1) comprises a substrate (10), a resistor layer (30), a drive circuit (35), a sealing member (43), and a first resin flow stopper (50). The resistor layer (30) includes a plurality of heat generation units (31). The sealing member (43) is formed by curing a sealing resin material and seals the drive circuit (35). The first resin flow stopper (50) stops the flow of the sealing resin material. The first resin flow stopper (50) is disposed between the drive circuit (35) and the resistor layer (30) and is in contact with the sealing member (43).
Inventors:
NAKATANI GORO (JP)
NISHI KOJI (JP)
NISHI KOJI (JP)
Application Number:
PCT/JP2023/012247
Publication Date:
January 18, 2024
Filing Date:
March 27, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
B41J2/345; B41J2/335
Domestic Patent References:
| WO2014132870A1 | 2014-09-04 |
Foreign References:
| JPS63205249A | 1988-08-24 | |||
| JP2004175049A | 2004-06-24 | |||
| JP2005335264A | 2005-12-08 | |||
| JP2019038184A | 2019-03-14 | |||
| JP2001071547A | 2001-03-21 | |||
| JP2001113740A | 2001-04-24 | |||
| US6028619A | 2000-02-22 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF:
Previous Patent: ANTENNA MODULE AND FRONT END CIRCUIT FOR USE IN SAME
Next Patent: CONVERSATION ASSISTANCE DEVICE
Next Patent: CONVERSATION ASSISTANCE DEVICE