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Patent Searching and Data


Title:
THERMAL RELAY
Document Type and Number:
WIPO Patent Application WO/2023/135887
Kind Code:
A1
Abstract:
The present invention is a thermal relay (1) that is provided, within a case, with: heat elements (8a-8c) that correspond to respective phases of a main circuit; a shifter (9) that engages in a slidable manner with an operating section (16b) of each heat element; and a contact point inversion mechanism (14) that can switch contact points (13) in coordination with sliding of the shifter. The heat elements are each provided with: a long plate-shaped bimetal (16) that is not a conduction path of the main circuit, with the operating section that engages with the shifter being provided at a longitudinal end thereof; and a heater (17) that is a conduction path of the main circuit and that comprises a first heater section (17c) that extends in the longitudinal direction while being in surface contact with a side surface of the bimetal, the first heater section transmitting heat to the bimetal by conducting an overload current.

Inventors:
MIURA HAYATO (JP)
KAMOSAKI TAKEO (JP)
ONOGI YUMA (JP)
RI SHUREN (JP)
Application Number:
PCT/JP2022/039319
Publication Date:
July 20, 2023
Filing Date:
October 21, 2022
Export Citation:
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Assignee:
FUJI ELECTRIC FA COMPONENTS & SYSTEMS CO LTD (JP)
International Classes:
H01H61/01; H01H61/013
Foreign References:
JPS5734945U1982-02-24
JP2001014999A2001-01-19
JPS52110374U1977-08-22
Attorney, Agent or Firm:
HIROSE Hajime et al. (JP)
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