Title:
THERMAL SENSOR AND METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/116016
Kind Code:
A1
Abstract:
The objective of the present invention is to improve the performance of a thermal sensor. In a thermal humidity sensor, a gap (space) between a first part (11a) and a second part (11b) forming a heater (11) has embedded therein an insulating film (30) which has a tensile stress and the thickness of which in a film thickness direction is less than the thickness of the heater (11), and a portion of an insulating film (6) having a compressive stress.
Inventors:
SAKUMA NORIYUKI (JP)
NAKANO HIROSHI (JP)
ONUKI HIROSHI (JP)
ANDO RYO (JP)
NAKANO HIROSHI (JP)
ONUKI HIROSHI (JP)
ANDO RYO (JP)
Application Number:
PCT/JP2019/039498
Publication Date:
June 11, 2020
Filing Date:
October 07, 2019
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
G01N25/58; G01F1/692; H01L29/84
Foreign References:
| JP2006242941A | 2006-09-14 | |||
| JP2000249584A | 2000-09-14 | |||
| JP2014006052A | 2014-01-16 | |||
| EP2348292A1 | 2011-07-27 | |||
| US20170188413A1 | 2017-06-29 |
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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