Title:
THERMALLY ACTUATED SWITCH AND MOLDING DIE
Document Type and Number:
WIPO Patent Application WO/2015/063833
Kind Code:
A1
Abstract:
This invention is a thermally actuated switch in which a sealed vessel contains a fixed contact and a heat-sensitive-plate assembly that has a structure in which a movable contact is anchored to one lengthwise end of a heat-sensitive plate, one end of a metal support is anchored to the other end of said heat-sensitive plate, and the heat-sensitive plate is then drawn. The heat-sensitive-plate assembly has a dish-shaped drawn section near the middle of the heat-sensitive plate and has folded sections between the area where the movable contact is anchored and the widthwise edges of the heat-sensitive plate and also between the area where the metal support is anchored and the widthwise edges of the heat-sensitive plate.
Inventors:
SATO SHIGEMI (JP)
ADACHI YUJI (JP)
ADACHI YUJI (JP)
Application Number:
PCT/JP2013/079125
Publication Date:
May 07, 2015
Filing Date:
October 28, 2013
Export Citation:
Assignee:
UBUKATA IND CO LTD (JP)
International Classes:
H01H37/52
Domestic Patent References:
| WO2009098735A1 | 2009-08-13 |
Foreign References:
| JPH10144189A | 1998-05-29 | |||
| JPH10144189A | 1998-05-29 |
Other References:
See also references of EP 3073506A4
Attorney, Agent or Firm:
SATO INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Satow international patent firm (JP)
Patent business corporation Satow international patent firm (JP)
Download PDF:
Previous Patent: DISPLAY DEVICE
Next Patent: SIGNAL-PROCESSING DEVICE AND METHOD, COMPUTER PROGRAM, AND STORAGE MEDIUM
Next Patent: SIGNAL-PROCESSING DEVICE AND METHOD, COMPUTER PROGRAM, AND STORAGE MEDIUM