Title:
THERMALLY-CONDUCTIVE ADDITION-CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/171352
Kind Code:
A1
Abstract:
A thermally-conductive silicone composition containing: (A) an organopolysiloxane having an alkenyl group bonded to at least two silicon atoms in one molecule; (B) an organohydrogenpolysiloxane having a hydrogen atom bonded to at least two silicon atoms in one molecule, wherein the silicon atom-bonded hydrogen atom amount in component (B) is 0.1-5.0 per one alkenyl group in component (A); (C) a thermally-conductive filler; (D) a complex of a metal and a 8-quinolinol, and (E) a platinum group metal catalyst. The thermally-conductive silicone composition provides a thermally-conductive silicone cured product enabling the suppression of the increase in hardness from an initial hardness during high temperature aging at 150°C.
Inventors:
TABATA YUJI (JP)
IWATA MITSUHIRO (JP)
IWATA MITSUHIRO (JP)
Application Number:
PCT/JP2023/006096
Publication Date:
September 14, 2023
Filing Date:
February 21, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/013; C08K5/3437; C08L83/05; C09K5/14
Domestic Patent References:
| WO2011132419A1 | 2011-10-27 | |||
| WO2022181281A1 | 2022-09-01 |
Foreign References:
| JP2001247581A | 2001-09-11 | |||
| EP1266903A1 | 2002-12-18 | |||
| JP2017057290A | 2017-03-23 | |||
| US20140322651A1 | 2014-10-30 | |||
| US20150234275A1 | 2015-08-20 | |||
| CN104423170A | 2015-03-18 | |||
| CN103145748A | 2013-06-12 | |||
| JPH09176495A | 1997-07-08 | |||
| JP2020529486A | 2020-10-08 | |||
| CN106243704A | 2016-12-21 | |||
| CN106702749A | 2017-05-24 |
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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