Title:
THERMALLY CONDUCTIVE COMPOSITION AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/008538
Kind Code:
A1
Abstract:
This thermally conductive composition includes a silicone main material, a viscosity reducer, and a thermally conductive filler. The ratio (Mw1/Mw2) of the weight average molecular weight Mw1 of the silicone main material and the weight average molecular weight Mw2 of the viscosity reducer is 0.5-8.5. The present invention makes it possible to provide a thermally conductive composition that includes a silicone main material, a viscosity reducer, and a thermally conductive filler and has a high viscosity reduction effect.
Inventors:
IWAMOTO TATSUYA (JP)
KANEKO TOSHIKI (JP)
UMETANI HIROSHI (JP)
KANEKO TOSHIKI (JP)
UMETANI HIROSHI (JP)
Application Number:
PCT/JP2022/029201
Publication Date:
February 02, 2023
Filing Date:
July 28, 2022
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
C08L83/04; C08K3/01; C08K3/22; C08L83/05; C08L83/06; C08L83/07
Domestic Patent References:
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Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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