Title:
THERMALLY CONDUCTIVE COMPOSITION FOR LOW OUTGASSING
Document Type and Number:
WIPO Patent Application WO/2013/051721
Kind Code:
A1
Abstract:
Provided is a composition that is highly workable, fast-curing, highly thermally conductive, and low-outgassing. A thermally conductive composition containing: (A) an insulating thermally conductive filler; (B) a polyalkylene glycol having a hydrolysable silyl group; (C) an organotitanium-based curing catalyst; and (D) a silane coupling agent; the (A) component containing: (A-1) a filler component having a mean particle diameter of 0.1 μm to less than 2 μm; (A-2) a filler component having a mean particle diameter of 2 μm to less than 20 μm; and (A-3) a filler component having a mean particle diameter of 20 μm to 100 μm. Preferably, the (B) component is (B-1) a polyalkylene glycol having a hydrolysable silyl group at both ends of a molecular chain or (B-2) a polyalkylene glycol having a hydrolysable silyl group at one end of a molecular chain. This composition can be used as a heat dissipation material, an adhesive agent, or a coating agent.
Inventors:
MIYAZAKI HAYATO (JP)
FUKAO KENJI (JP)
GOTO YOSHITSUGU (JP)
FUKAO KENJI (JP)
GOTO YOSHITSUGU (JP)
Application Number:
PCT/JP2012/076040
Publication Date:
April 11, 2013
Filing Date:
October 05, 2012
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
International Classes:
C08L71/02; C08K3/00; C08K5/057; C08K5/07; C08K5/098; C08K5/5415; C09D7/61; C09D171/00; C09J11/04; C09J11/06; C09J171/00
Domestic Patent References:
| WO2010041708A1 | 2010-04-15 | |||
| WO2011125636A1 | 2011-10-13 |
Foreign References:
| JP2006274094A | 2006-10-12 | |||
| JP2001302936A | 2001-10-31 | |||
| JPH0314873A | 1991-01-23 | |||
| JP2000063873A | 2000-02-29 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
SK patent business corporation (JP)
SK patent business corporation (JP)
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Claims: