Title:
THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE MEMBER
Document Type and Number:
WIPO Patent Application WO/2023/080202
Kind Code:
A1
Abstract:
A thermally conductive composition according to the present invention comprises a liquid polymer, a thermally conductive filler, and a structural viscosity-imparting agent, wherein the viscosity ratio (η1/η3) of a viscosity η1 measured with a rheometer at a measurement temperature of 25ºC and a shear speed of 0.00252 (1/s) to a viscosity η3 measured with a rheometer at a measurement temperature of 25ºC and a shear speed of 0.05432 (1/s) is greater than 10. With the present invention, it is possible to provide a thermally conductive composition in which settling of a thermally conductive filler during storage can be suppressed, and which has excellent handleability when used.
Inventors:
KITADA GAKU (JP)
KANEKO TOSHIKI (JP)
KANEKO TOSHIKI (JP)
Application Number:
PCT/JP2022/041195
Publication Date:
May 11, 2023
Filing Date:
November 04, 2022
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
C08L101/00; C08K5/101; C08L83/04; C08L83/07; C09K5/06; H01L23/36
Domestic Patent References:
| WO2017002890A1 | 2017-01-05 | |||
| WO2021095507A1 | 2021-05-20 | |||
| WO2020095902A1 | 2020-05-14 |
Foreign References:
| JP2018065977A | 2018-04-26 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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