Title:
THERMALLY CONDUCTIVE COMPOSITION PACKAGE, AND TWO-COMPONENT CURING TYPE THERMALLY CONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/262407
Kind Code:
A1
Abstract:
This thermally conductive composition package comprises a resin container and a thermally conductive silicone-based composition that is packed inside the resin container. The moisture permeability of the resin container is 0.01-10 g/m2·24 hr. The thermally conductive silicone-based composition contains: an alkenyl group-containing organopolysiloxane; a hydrogenorganopolysiloxane; a thermally conductive filler; and a specific silicon compound. The content of the specific silicon compound relative to the total amount of organic silicon-based compounds in the thermally conductive silicone-based composition is 0.1-10 mass%. According to the present invention, it is possible to prevent a decrease in curing properties even if a curable thermally conductive silicone-based composition is packed in the resin container and then stored for a long period of time.
Inventors:
UMETANI HIROSHI (JP)
KUDOH HIROKI (JP)
KUDOH HIROKI (JP)
Application Number:
PCT/JP2020/024668
Publication Date:
December 30, 2020
Filing Date:
June 23, 2020
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
C08L83/07; C08K3/01; C08K5/541; C08L83/04; C08L83/06
Domestic Patent References:
| WO2015155950A1 | 2015-10-15 | |||
| WO2019021826A1 | 2019-01-31 |
Foreign References:
| JP2000080280A | 2000-03-21 |
Other References:
See also references of EP 3992252A4
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
Download PDF: