Title:
THERMALLY CONDUCTIVE COMPOSITION, SEMICONDUCTOR DEVICE, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR BONDING HEAT SINK PLATE
Document Type and Number:
WIPO Patent Application WO/2017/006854
Kind Code:
A1
Abstract:
The thermally conductive composition according to the present invention comprises metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, the metal particles (A) sintering upon a heat treatment to thereby form a connected-particle structure. The metal particles (A) have a volume-cumulative distribution in which the 50%-cumulative particle diameter D50 is 0.8-5 µm, and the metal particles (A) have a standard deviation of particle diameter of 2.0 µm or less.
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Inventors:
SHIMOBE YASUO (JP)
MURAYAMA RYUICHI (JP)
SAITOH KEIICHIRO (JP)
MURAYAMA RYUICHI (JP)
SAITOH KEIICHIRO (JP)
Application Number:
PCT/JP2016/069614
Publication Date:
January 12, 2017
Filing Date:
July 01, 2016
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C09K5/14; C08F2/44; C08F20/10; C08K3/08; C08L33/04; C08L101/00; C09J4/00; C09J4/02; C09J5/06; C09J9/00; C09J11/04; C09J163/00; H01L21/52; H01L23/36; H01L23/373; H01L23/40
Domestic Patent References:
| WO2009133897A1 | 2009-11-05 | |||
| WO2014038331A1 | 2014-03-13 |
Foreign References:
| JP2012052198A | 2012-03-15 | |||
| JP2014125596A | 2014-07-07 | |||
| JP2013214733A | 2013-10-17 |
Other References:
See also references of EP 3321339A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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