Title:
THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE SHEET OBTAINED FROM SAME, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/135857
Kind Code:
A1
Abstract:
A thermally conductive composition which comprises a matrix resin comprising a heat-curable resin, a curing catalyst, and thermally conductive particles, wherein the thermally conductive particles comprise (a) 600-1,500 parts by mass of spherical alumina having an average particle diameter exceeding 100 μm, (b) 100-400 parts by mass of alumina having an average particle diameter of 1 μm or smaller, and (c) 500-1,500 parts by mass of aluminum nitride having an average particle diameter of 0.8-150 μm, per 100 parts by mass of the matrix resin. The thermally conductive composition, in a defoamed uncured state, has a plasticity of 80 or less. This thermally conductive composition hence has a high thermal conductivity, a low plasticity, and satisfactory moldability. A thermally conductive sheet obtained from the thermally conductive composition and a method for producing the thermally conductive sheet are also provided.
Inventors:
KAMIYA YUKI
Application Number:
PCT/JP2022/033235
Publication Date:
July 20, 2023
Filing Date:
September 05, 2022
Export Citation:
Assignee:
FUJI POLYMER IND (JP)
International Classes:
C08L101/00; C08J5/18; C08K3/22; C08K3/28; C08L83/04; H01L23/36
Domestic Patent References:
| WO2020137086A1 | 2020-07-02 | |||
| WO2020137970A1 | 2020-07-02 | |||
| WO2009136542A1 | 2009-11-12 | |||
| WO2020137970A1 | 2020-07-02 | |||
| WO2018088416A1 | 2018-05-17 |
Foreign References:
| JP2018021156A | 2018-02-08 | |||
| JP2013147600A | 2013-08-01 | |||
| JP2021518466A | 2021-08-02 | |||
| JP2016216523A | 2016-12-22 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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