Title:
THERMALLY CONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/057678
Kind Code:
A1
Abstract:
A thermally conductive composition according to the present invention contains: as component A, 100 parts by mass of an addition-curable organopolysiloxane that has a kinematic viscosity of 100 to 3,000 mm2/s at 25°C; as component B, 60 to 150 parts by mass of spherical aggregated boron nitride particles; and as component C, 120 to 240 parts by mass of amorphous alumina particles which have a median diameter D50 of 0.1 to 1 µm, and some or all of which are surface treated with an alkoxysilane compound that is represented by RaSi(OR')4-a (wherein R represents an unsubstituted or substituted organic group having 8 to 12 carbon atoms; R' represents an alkyl group having 1 to 4 carbon atoms; and a is 0 or 1) or a partial hydrolysis product of the alkoxysilane compound. The spherical aggregated boron nitride particles include: spherical aggregated boron nitride particles (B1) which have a median diameter D50 of 10 µm to 30 µm; and spherical aggregated boron nitride particles (B2) which have a median diameter D50 of more than 30 µm but not more than 100 µm, the median diameter D50 being not less than twice the median diameter D50 of B1.
Inventors:
KATAISHI TAKUMI
Application Number:
PCT/JP2023/024488
Publication Date:
March 21, 2024
Filing Date:
June 30, 2023
Export Citation:
Assignee:
FUJI POLYMER IND (JP)
International Classes:
C08L83/04; C08K3/22; C08K3/38; C08K5/5415; C08K9/06; C09K5/14
Domestic Patent References:
| WO2021187609A1 | 2021-09-23 | |||
| WO2022158029A1 | 2022-07-28 |
Foreign References:
| JP2015006980A | 2015-01-15 | |||
| JP2011144234A | 2011-07-28 | |||
| JP7015424B1 | 2022-02-02 | |||
| JP7047199B1 | 2022-04-04 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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