Title:
THERMALLY CONDUCTIVE COVER FOR PIPING SYSTEM, PIPING SYSTEM HEATING DEVICE, MANUFACTURING METHOD AND ATTACHMENT METHOD FOR THERMALLY CONDUCTIVE COVER, AND MANUFACTURING METHOD AND ATTACHMENT METHOD FOR HEATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/150518
Kind Code:
A1
Abstract:
Provided is a thermally conductive cover which improves workability in terms of attachment and removal. This thermally conductive cover (10) has a first thermally conductive member (11) in which connecting holes (11c) are formed, and a second thermally conductive member (12) in which connecting holes (12c) are formed. In addition, the thermally conductive cover (10) has connecting members (13) which have a first insertion part (13a) inserted into the insertion holes (11c) and a second insertion part (13b) inserted into the connecting holes (12c). The insertion parts (13a) and/or the insertion parts (13b) can be elastically deformed in a direction orthogonal to the insertion direction of the connecting members (13).
Inventors:
YAMASHITA KAORI (JP)
Application Number:
PCT/JP2017/005723
Publication Date:
August 23, 2018
Filing Date:
February 16, 2017
Export Citation:
Assignee:
NICHIAS CORP (JP)
International Classes:
F16L53/00; F16B19/00
Foreign References:
| JP2003185086A | 2003-07-03 | |||
| JPS59131011A | 1984-07-27 | |||
| JP2010071314A | 2010-04-02 | |||
| JP2007002986A | 2007-01-11 | |||
| JPH10204943A | 1998-08-04 | |||
| EP1529966A1 | 2005-05-11 | |||
| JPH05507545A | 1993-10-28 | |||
| GB2180611A | 1987-04-01 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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