Title:
THERMALLY-CONDUCTIVE, ELECTRICALLY-CONDUCTIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/104046
Kind Code:
A1
Abstract:
A thermally-conductive, electrically-conductive adhesive composition including an electrically-conductive filler (A), an epoxy resin (B), and a curing agent (C). The electrically-conductive filler (A) is submicron silver microparticles and the amount of silver microparticles blended therein is 75%-94% by mass of the total amount of thermally-conductive, electrically-conductive adhesive composition. The amount of epoxy resin (B) blended therein is 5%-20% by mass of the total amount of thermally-conductive, electrically-conductive adhesive composition. The curing agent (C) is a compound indicated by general formula (I), (II), or (III) and the amount of said compound blended therein is 0.4-2.4 molar equivalent as the active hydrogen equivalent weight, per epoxy group molar equivalent for the epoxy resin (B). Before sintering of the electrically-conductive filler (A) is commenced during thermal hardening, the thermally-conductive, electrically-conductive adhesive composition is in an uncured or semi-cured state. (In formula (I), X indicates -SO2-, -CH2-, or -O- and R1-R4 each independently indicate a hydrogen atom or a lower alkyl group. In formula (II), X indicates -SO2-, -CH2-, or -O- and R5-R8 each independently indicate a hydrogen atom or a lower alkyl group. In formula (III), X indicates -SO2-, -CH2-, or -O-, and R9-R12 each independently indicate a hydrogen atom or a lower alkyl group.)
Inventors:
OCHI KOICHI (JP)
IRIFUNE AKIRA (JP)
ICHIKAWA NATSUKO (JP)
HARADA MIYUKI (JP)
FURUSHO RIKIA (JP)
KONDO TAKESHI (JP)
OKUDA AKIHIKO (JP)
IRIFUNE AKIRA (JP)
ICHIKAWA NATSUKO (JP)
HARADA MIYUKI (JP)
FURUSHO RIKIA (JP)
KONDO TAKESHI (JP)
OKUDA AKIHIKO (JP)
Application Number:
PCT/JP2013/084552
Publication Date:
July 03, 2014
Filing Date:
December 25, 2013
Export Citation:
Assignee:
KANSAI UNIVERSITY (JP)
TANAKA PRECIOUS METAL IND (JP)
TANAKA PRECIOUS METAL IND (JP)
International Classes:
C09J163/00; C09J9/02; C09J11/04; C09J11/06; H01B1/00; H01B1/22
Foreign References:
| JPH0196278A | 1989-04-14 | |||
| JP2012052051A | 2012-03-15 | |||
| JP2004359830A | 2004-12-24 | |||
| JP2008186590A | 2008-08-14 | |||
| JPH06322350A | 1994-11-22 | |||
| JP2009084510A | 2009-04-23 |
Other References:
See also references of EP 2940093A4
Attorney, Agent or Firm:
SHIMAZAKI Eiichiro (JP)
Eiichiro Shimazaki (JP)
Eiichiro Shimazaki (JP)
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