Title:
THERMALLY CONDUCTIVE GASKET
Document Type and Number:
WIPO Patent Application WO/2021/200298
Kind Code:
A1
Abstract:
The present invention provides a thermally conductive gasket that can demonstrate, even with a small compression force, gasket thermal conductivity equivalent to that of a sold-type gasket between conductors. The thermally conductive gasket 1 is such that, in a cross section orthogonal to an axis of a thermally conductive elastic body 10, when a represents the widthwise dimension orthogonal to a compression direction for each of through holes 11, b represents the vertical dimension along the compression direction for each of the through holes 11, H1 represents the height of the thermally conductive gasket 1 before being compressed in the compression direction, H2 represents the height of the thermally conductive gasket 1 after being compressed in the compression direction, and H3 represents the result of subtracting from H1 the sum of the vertical dimensions of the through holes 11, the relationships a > b and H2 ≤ H3 are satisfied.
Inventors:
NAKAGAWA ICHIRO (JP)
NAKAMURA TATSUYA (JP)
NAKAMURA TATSUYA (JP)
Application Number:
PCT/JP2021/011540
Publication Date:
October 07, 2021
Filing Date:
March 19, 2021
Export Citation:
Assignee:
KITAGAWA IND CO LTD (JP)
International Classes:
F16J15/10
Foreign References:
| JP2012079927A | 2012-04-19 | |||
| JP2010283008A | 2010-12-16 | |||
| JP2000124654A | 2000-04-28 | |||
| JPH09307263A | 1997-11-28 | |||
| US7470866B2 | 2008-12-30 | |||
| US7732714B2 | 2010-06-08 |
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
Download PDF: