Title:
THERMALLY CONDUCTIVE GREASE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/070069
Kind Code:
A1
Abstract:
The present invention pertains to a thermally conductive grease composition containing a matrix resin and a thermally conductive filler. The matrix resin contains a liquid dimethylpolysiloxane (A) having a kinematic viscosity of 100-10,000 mm2/s at 40°C, and a liquid organopolysiloxane (B) having a kinematic viscosity of 1-10,000 mm2/s at 40°C. When the total amount of the liquid dimethylpolysiloxane (A) and the liquid organopolysiloxane (B) is defined as 100 parts by mass, the matrix resin contains 50-97 parts by mass of the liquid dimethylpolysiloxane (A) and 3-50 parts by mass of the liquid organopolysiloxane (B). When the total number of organic groups in the liquid organopolysiloxane (B) excluding organic groups bound to silicon atoms at both ends is defined as 100%, 30-70% of the total number of organic groups is a methyl group and 30-70% of the total number of organic groups is a saturated hydrocarbon group having 2-14 carbon atoms.
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Inventors:
KATAISHI TAKUMI
Application Number:
PCT/JP2023/021847
Publication Date:
April 04, 2024
Filing Date:
June 13, 2023
Export Citation:
Assignee:
FUJI POLYMER IND (JP)
International Classes:
C08L83/04; C08K3/013; C08K3/22; C08K3/28; C08K5/5415; C08K9/06; C09K5/14
Foreign References:
| JP2015140395A | 2015-08-03 | |||
| JP2014084403A | 2014-05-12 | |||
| JP2008222776A | 2008-09-25 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
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