Title:
THERMALLY-CONDUCTIVE MATERIAL AND FABRICATION METHOD THEREFOR, PREPREG, LAMINATE, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/206509
Kind Code:
A1
Abstract:
Embodiments of the present application provide a thermally-conductive material and a fabrication method therefor, a prepreg, a laminate, and a circuit board, which relate to the technical field of nanomaterials, and are used for providing a thermally-conductive material having higher thermal conductivity. The thermally-conductive material comprises a matrix polymer, a curing agent and a modified thermally-conductive filler. The modified thermally-conductive filler comprises a thermally-conductive filler and a liquid crystal polymer that is graftingly coated on the surface of the thermally-conductive filler. The liquid crystal polymer is used to modify the thermally-conductive filler. In the modified thermally-conductive filler, a chemical-bond connection is formed between the liquid crystal polymer and the matrix polymer by means of the curing agent. Alternatively, the thermally-conductive material comprises a matrix polymer, a liquid crystal polymer, a curing agent, and a thermally-conductive filler. The thermally-conductive filler is filled within the matrix polymer. At least a portion of the surface of the thermally-conductive filler is coated with the liquid crystal polymer. A chemical-bond connection is formed between the liquid crystal polymer and the matrix polymer by means of the curing agent. The affinity between the liquid crystal polymer and the thermally-conductive filler is greater than the affinity between the matrix polymer and the thermally-conductive filler.
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Inventors:
ZHANG QIYAN (CN)
CAI LI (CN)
GAO FENG (CN)
CAI LI (CN)
GAO FENG (CN)
Application Number:
PCT/CN2022/082479
Publication Date:
October 06, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
C08L63/00; B32B15/092; B32B27/20; B32B27/38; C08K3/28; C08K3/36; C08K3/38; C08K9/04; C08L71/12; C08L79/08; C08L83/00; H05K1/03; H05K3/46
Domestic Patent References:
| WO2020045560A1 | 2020-03-05 |
Foreign References:
| CN105669950A | 2016-06-15 | |||
| CN107057364A | 2017-08-18 | |||
| CN105906844A | 2016-08-31 | |||
| CN111205594A | 2020-05-29 | |||
| CN103562308A | 2014-02-05 | |||
| CN103013411A | 2013-04-03 | |||
| JP2008106126A | 2008-05-08 | |||
| US20050245644A1 | 2005-11-03 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT&TRADEMARK AGENT LTD. (CN)
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