Title:
THERMALLY CONDUCTIVE MATERIAL, WIRING HARNESS AND ELECTRICAL RELAY COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/161765
Kind Code:
A1
Abstract:
The present invention provides: a thermally conductive material which is capable of achieving a good balance between heat dissipation performance and reduction in weight; a wiring harness; and an electrical relay component. A thermally conductive material which contains a base resin and an insulating filler, wherein: the insulating filler contains a thermally conductive filler and a hollow filler that is composed of particles each internally containing a gas layer; the content of the insulating filler is from 20.0% by volume to 90.0% by volume based on the total amount of the material; and the content of the hollow filler is from 25.0% by volume to 70.0% by volume based on the total amount of the insulating filler. A wiring harness 4 is provided with: an insulated wire 5 which is configured from an insulating cover 9 and a conductor 8; an exterior cladding material 6 into which the insulated wire 5 is inserted; and a heat dissipation material 7 which is arranged between the insulated wire 5 and the exterior cladding material 6. The heat dissipation material 7 is configured from the above-described thermally conductive material. An electrical relay component comprises a bus bar to which a high-voltage electric wire is connected and a housing to which the bus bar is affixed; and the housing is configured from the above-described thermally conductive material.
Inventors:
KAWAKAMI TAKASHI (JP)
NAKASHIMA KAZUO (JP)
MAEDA YUSAKU (JP)
NAKASHIMA KAZUO (JP)
MAEDA YUSAKU (JP)
Application Number:
PCT/JP2021/002415
Publication Date:
August 19, 2021
Filing Date:
January 25, 2021
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
C08K7/02; C08K3/22; C08K3/38; C08K7/22; C08K7/28; C08L101/00; C09K5/14; H01B3/46; H01B7/00; H01B7/18; H01B7/42; H05K7/06; H05K7/20
Domestic Patent References:
| WO2018135140A1 | 2018-07-26 |
Foreign References:
| US20190367791A1 | 2019-12-05 | |||
| CN109181134A | 2019-01-11 | |||
| JP2004315761A | 2004-11-11 | |||
| CN109206849A | 2019-01-15 | |||
| JP2020009974A | 2020-01-16 | |||
| JPH06252572A | 1994-09-09 | |||
| JP2007112843A | 2007-05-10 |
Attorney, Agent or Firm:
WENO & PARTNERS (JP)
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