Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION AND THERMALLY CONDUCTIVE RESIN MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/191238
Kind Code:
A1
Abstract:
Provided is a thermally conductive resin composition which can have improved thermal conductivity while being inhibited from having an increased viscosity. The thermally conductive resin composition comprises a first resin phase, a second resin phase, and a thermally conductive filler. The first resin phase and the second resin phase are separate from each other. The thermally conductive filler is present in the first resin phase in a higher density than in the second resin phase. Since the thermally conductive filler is present more in the first resin phase than in the second resin phase, particles of the thermally conductive filler are more apt to be in contact with each other than in the case where the thermally conductive filler is dispersed equally in the first resin phase and the second resin phase.
Inventors:
KOMATSU KEIICHI
KASUE ASAHI
YAMAGUCHI ATSUSHI
KASUE ASAHI
YAMAGUCHI ATSUSHI
Application Number:
PCT/JP2022/010288
Publication Date:
September 15, 2022
Filing Date:
March 09, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L81/06; C08K3/013; C08L63/00; C08L101/12; C09K5/14
Domestic Patent References:
| WO2015174023A1 | 2015-11-19 | |||
| WO2014155975A1 | 2014-10-02 |
Foreign References:
| JP2017014302A | 2017-01-19 | |||
| JP2018115276A | 2018-07-26 | |||
| JP2013194223A | 2013-09-30 | |||
| JP2005255867A | 2005-09-22 | |||
| JP2009263476A | 2009-11-12 | |||
| JP2012140509A | 2012-07-26 | |||
| JP2016166374A | 2016-09-15 | |||
| JP2018050018A | 2018-03-29 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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