Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION, THERMALLY CONDUCTIVE SHEET, AND PRODUCTION METHODS
Document Type and Number:
WIPO Patent Application WO/2020/240703
Kind Code:
A1
Abstract:
The present invention relates to a thermally conductive resin composition which comprises a polyol compound (A), a thermally conductive filler (B), a plasticizer (C), a dehydrating agent (D) that physically adsorbs water, and a polyisocyanate compound (E), wherein the thermally conductive filler (B) has a maximum particle diameter of 20 μm or larger, an average particle diameter of 3 μm or larger but smaller than 10 μm, and a volume content of filler particles with diameters ranging from 10 μm to 300 μm of 20 vol% or greater and the content of the thermally conductive filler (B) is 260-600 parts by mass per 100 parts by mass of the sum of the polyol compound (A), plasticizer (C), and polyisocyanate compound (E).
Inventors:
NAKATANI KOJI (JP)
Application Number:
PCT/JP2019/021123
Publication Date:
December 03, 2020
Filing Date:
May 28, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
C08L75/04; C08G18/08; C08G18/79; C08K3/22; C08K3/34; C08K5/09; C08K9/02
Domestic Patent References:
| WO2016181583A1 | 2016-11-17 |
Foreign References:
| JP2017025197A | 2017-02-02 | |||
| JP2009231281A | 2009-10-08 | |||
| JP2018135508A | 2018-08-30 | |||
| JP2010155942A | 2010-07-15 | |||
| JP2007284547A | 2007-11-01 | |||
| JP2002069293A | 2002-03-08 | |||
| JP2008115356A | 2008-05-22 | |||
| JP2010248350A | 2010-11-04 | |||
| JP2005002297A | 2005-01-06 | |||
| JP2013018988A | 2013-01-31 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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