Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/050690
Kind Code:
A1
Abstract:
Disclosed is a resin composition having low heat resistance and excellent handleability, which can be formed into a thin film even at low temperatures. This resin composition is suitable for a heat dissipating material for heat-generating electronic components. Specifically disclosed is a resin composition containing 5-20 parts by volume of an ethylene-vinyl acetate copolymer (a), 2-20 parts by volume of a polyethylene wax (b), 1-20 parts by volume of a pinene-phenol copolymer (c) and 40-75 parts by volume of a thermally conductive inorganic powder (d). Preferably, the resin composition may further contain 3-10 parts by volume of a fluid paraffin (e) and/or 0.01-10 parts by volume of a metal alloy (f) having a melting point of not more than 80˚C.
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Inventors:
OKADA TAKUYA (JP)
ITAHASHI YASUHIKO (JP)
ITAHASHI YASUHIKO (JP)
Application Number:
PCT/JP2007/070473
Publication Date:
May 02, 2008
Filing Date:
October 19, 2007
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
OKADA TAKUYA (JP)
ITAHASHI YASUHIKO (JP)
OKADA TAKUYA (JP)
ITAHASHI YASUHIKO (JP)
International Classes:
C08L23/08; C08K3/22; H01L23/373; H05K7/20
Foreign References:
| JP2006049876A | 2006-02-16 | |||
| JP2005187700A | 2005-07-14 | |||
| JP2004335872A | 2004-11-25 | |||
| JP2004221605A | 2004-08-05 | |||
| JP2006503166A | 2006-01-26 | |||
| JP2003152147A | 2003-05-23 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (SIA Kanda Square17, Kanda-konyach, Chiyoda-ku Tokyo, JP)
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