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Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/100174
Kind Code:
A1
Abstract:
Provided is a thermally conductive resin composition, the thermal conductivity of which is enhanced by incorporating a specific thermally conductive inorganic filler without increasing the content thereof. Further, the thermally conductive resin composition also exhibits excellent moldability. The thermally conductive resin composition comprises a thermally conductive filler component and a binder resin, said thermally conductive filler component comprising both a hard filler having a Mohs' hardness of 5 or more and a soft filler having a Mohs' hardness of 3 or less. In the structure of a shaped body obtained by molding the resin composition, the soft filler is pressed by the hard filler, and the surface of the soft filler thus pressed is deformed by the hard filler to achieve the surface contact with the hard filler.

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Inventors:
KUSUNOKI TOMOKAZU
KOTANI YUKI
YODEN HIROYOSHI
SAWADA TOMOAKI
BABA DAIZO
Application Number:
PCT/JP2012/084275
Publication Date:
July 04, 2013
Filing Date:
December 26, 2012
Export Citation:
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Assignee:
PANASONIC CORP (JP)
International Classes:
C08L101/00; B29C43/02; C08K3/22; C08K3/26; C08K3/34; C08K3/36; C08K3/38; C08K7/00; C09K5/08; H01L23/29; H01L23/31; B29K105/16
Domestic Patent References:
WO2010021167A12010-02-25
Foreign References:
JP2011195673A2011-10-06
JP2011132367A2011-07-07
JP2011132368A2011-07-07
JP2011111498A2011-06-09
JP2011127053A2011-06-30
JP2011168672A2011-09-01
JP2010205498A2010-09-16
JP2011075787A2011-04-14
JP2007146129A2007-06-14
JP2001503471A2001-03-13
JP2010242022A2010-10-28
JPH11246884A1999-09-14
JPH11246885A1999-09-14
JPH03200397A1991-09-02
JP2012087250A2012-05-10
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
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