Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/129805
Kind Code:
A1
Abstract:
The present invention relates to a thermally conductive resin composition comprising: (A) 20-50 wt% of a liquid crystal polymer; and (B) 50-80 wt% of a spherical thermally conductive filler surface-treated with a silane-based oligomer, wherein the liquid crystal polymer (A) is a copolymer of an aromatic hydroxycarboxylic acid, an aromatic diol and an aromatic dicarboxylic acid, and the resin composition has remarkable thermal conductivity without deteriorating mechanical properties.
Inventors:
KIM NAM HYUN (KR)
SHIN CHAN GYUN (KR)
LIM JONG CHEOL (KR)
JEON BYUNG KUK (KR)
SHIN CHAN GYUN (KR)
LIM JONG CHEOL (KR)
JEON BYUNG KUK (KR)
Application Number:
PCT/KR2014/001356
Publication Date:
August 28, 2014
Filing Date:
February 20, 2014
Export Citation:
Assignee:
CHEIL IND INC (KR)
International Classes:
C08L67/03; C08G2/22; C08K9/06; H01B1/20
Foreign References:
| KR20120080192A | 2012-07-16 | |||
| KR20080009643A | 2008-01-29 | |||
| KR100712079B1 | 2007-05-02 | |||
| KR20050106009A | 2005-11-08 | |||
| JPH11134944A | 1999-05-21 | |||
| KR20130078190A | 2013-07-10 |
Attorney, Agent or Firm:
CHOI, DUK KYU (KR)
최덕규 (KR)
최덕규 (KR)
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