Title:
THERMALLY-CONDUCTIVE RESIN SHEET
Document Type and Number:
WIPO Patent Application WO/2020/153377
Kind Code:
A1
Abstract:
The thermally-conductive resin sheet according to the present invention has a thermal conductivity rate of 7 W/m·K or more and a 30%-compression strength of 1500 kPa or less, and exhibits, after a heat resistance test of being subjected to heat application for 1000 hours at 150°C, a change rate of 30% or less in terms of the 30%-compression strength. According to the present invention, it is possible to provide a thermally-conductive resin sheet that shows excellent long term stability in physical properties such as thermal conductivity, flexibility, and not becoming stiff over time.
Inventors:
HOSHIYAMA YUUKI (JP)
Application Number:
PCT/JP2020/001992
Publication Date:
July 30, 2020
Filing Date:
January 21, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01L23/36; C08J5/18; C08J7/00; C08K3/38; C08L21/00
Domestic Patent References:
| WO2018101445A1 | 2018-06-07 | |||
| WO2018030430A1 | 2018-02-15 | |||
| WO2019022070A1 | 2019-01-31 |
Foreign References:
| JP2010132866A | 2010-06-17 | |||
| JP2011162642A | 2011-08-25 | |||
| JP2013103375A | 2013-05-30 | |||
| JP2010077220A | 2010-04-08 | |||
| JP2012038763A | 2012-02-23 | |||
| JP2013254880A | 2013-12-19 |
Other References:
See also references of EP 3916774A4
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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