THERMALLY CONDUCTIVE SHEET AND PROCESS FOR PRODUCING SAME

Title:

THERMALLY CONDUCTIVE SHEET AND PROCESS FOR PRODUCING SAME

Document Type and Number:

WIPO Patent Application WO/2011/158942

Kind Code:

A1

Abstract:

Provided is a thermally conductive sheet which has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces and which has high thermal conductivity in the thickness direction. The thermally conductive sheet is hence suitable for use as a member to be interposed between any of various heat sources and a radiation member. Also provided is a process for producing the thermally conductive sheet. The process for producing the thermally conductive sheet comprises: an extrusion molding step in which a thermally conductive composition comprising a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded object in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded object is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.

Inventors:

ARAMAKI KEISUKE (JP)
USUI HIROYUKI (JP)

Application Number:

PCT/JP2011/063955

Publication Date:

December 22, 2011

Filing Date:

June 17, 2011

Export Citation:

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Assignee:

SONY CHEM & INF DEVICE CORP (JP)
ARAMAKI KEISUKE (JP)
USUI HIROYUKI (JP)

International Classes:

C08J5/18; B29C48/07; B29C48/08; B29C48/91; C08K3/00; C08K7/06; C08L83/04; H01L23/36

Foreign References:

JP2010056299A	2010-03-11
JP2002046137A	2002-02-12
JP2009055021A	2009-03-12
JP2010515807A	2010-05-13
JP2010260225A	2010-11-18
JP2010056299A	2010-03-11
JP2010050240A	2010-03-04
JP2009055021A	2009-03-12
JP2003200437A	2003-07-15

Other References: