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Patent Searching and Data


Title:
THERMALLY-CONDUCTIVE SHEET AND THERMALLY-CONDUCTIVE SHEET PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/264895
Kind Code:
A1
Abstract:
Provided is a thermally-conductive sheet having excellent adhesion to a heating body, and capable of suppressing excessive bleeding of a binder resin. The thermally-conductive sheet 1 comprises a cured product of a composition containing a binder resin 2, an anisotropic thermally-conductive filler 3, and another thermally-conductive filler 4 other than the anisotropic thermally-conductive filler 3, and satisfies conditions 1 and 2 below. [Condition 1] The tack force of the thermally-conductive sheet 1 is 80 gf or more. [Condition 2] With the thermally-conductive sheet 1 at a thickness of 1 mm and a size of 25 mm × 25 mm, and in a 40% compressed state, the amount of bleeding of the binder resin 2 after leaving the thermally-conductive sheet 1 for 48 hours at 125°C is 0.20 g or less.

Inventors:
SATO YUMA (JP)
KUBO YUSUKE (JP)
Application Number:
PCT/JP2022/023095
Publication Date:
December 22, 2022
Filing Date:
June 08, 2022
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L23/36; C08J5/18; C08K3/013; C08K3/22; C08K3/28; C08K3/38; C08K7/00; C08K7/04; C08L83/04; C08L83/05; C08L83/07; C08L101/00; H01L23/373; H05K7/20
Foreign References:
JP2020196828A2020-12-10
JP2020155682A2020-09-24
JP2011127053A2011-06-30
JP2020129628A2020-08-27
JP2020013872A2020-01-23
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro et al. (JP)
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