Title:
THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2015/037626
Kind Code:
A1
Abstract:
A thermally conductive sheet which comprises a thermally conductive tacky layer and a non-tacky resin layer superposed thereon, wherein the thermally conductive tacky layer comprises a thermally conductive filler and an acrylic resin obtained by curing an acrylic compound and has higher tackiness than the non-tacky resin layer and the non-tacky resin layer is formed from a resin composition that comprises: a resin having at least one functional group selected from a hydroxyl group, a carboxyl group, and a glycidyl group and having a glass transition temperature of 10°C or higher; a hardener; and a flame-retardant filler. The non-tacky resin layer has tackiness of 6-30 kN/m2 in terms of probe tack measured by pushing a cylindrical aluminum probe against the non-tacky resin layer and separating the probe therefrom under the conditions of a pushing speed of 30 mm/min, a separating speed of 120 mm/min, a load of 196 g, a pushing time of 5.0 sec, a pulling distance of 5 mm, a probe heating of 40°C, and a sheet stage heating of 40°C.
Inventors:
SUGITA JUNICHIRO (JP)
Application Number:
PCT/JP2014/073954
Publication Date:
March 19, 2015
Filing Date:
September 10, 2014
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01L23/373; C09J4/02; C09J7/02; C09J9/00; C09J11/04; C09J11/06; C09J133/00; H05K7/20
Domestic Patent References:
| WO2011096287A1 | 2011-08-11 | |||
| WO2010035614A1 | 2010-04-01 |
Foreign References:
| JP2004225022A | 2004-08-12 | |||
| JP2002121508A | 2002-04-26 | |||
| JP2002069400A | 2002-03-08 | |||
| JP2003321658A | 2003-11-14 | |||
| JP2010093077A | 2010-04-22 | |||
| JP2007123624A | 2007-05-17 |
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
Takamatsu 猛 (JP)
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