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Patent Searching and Data


Title:
THERMALLY CONDUCTIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2016/104074
Kind Code:
A1
Abstract:
The present invention provides a thermally conductive sheet having increased thermal conductivity. Provided is a thermally conductive sheet being a sheet-like molded article formed by curing a mixed composition that includes a pre-cure polymer matrix, a flat graphite powder, and a thermally conductive filling material having an aspect ratio of 2 or less, and being characterized in that the flat plane of the flat graphite powder is oriented in the thickness direction of the sheet. The thermally conductive sheet, given that the sheet includes a flat graphite powder as well as a thermally conductive filling material, can be filled with a high concentration of a thermally conductive substance, and has excellent flexibility and sheet surface tackiness.

Inventors:
WATANABE YASUYOSHI (JP)
SAKAGUCHI YOSHIYA (JP)
NAKAYAMA MASAFUMI (JP)
Application Number:
PCT/JP2015/083781
Publication Date:
June 30, 2016
Filing Date:
December 01, 2015
Export Citation:
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Assignee:
POLYMATECH JAPAN CO LTD (JP)
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L23/373; H01L23/36; H05K7/20
Foreign References:
JP2002363421A2002-12-18
JP2012238820A2012-12-06
Attorney, Agent or Firm:
OHTAKE, Seigo (JP)
Shogo Otake (JP)
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