Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/203924
Kind Code:
A1
Abstract:
A thermally conductive silicone composition having an organopolysiloxane as a base polymer and containing a thermally conductive filler, wherein the thermally conductive silicone composition that includes aluminum nitride having an average particle size of 10-100 μm and crushed alumina having an average particle size of 0.1-5 μm as a thermally conductive filler, contains 15-55 mass% of crushed alumina in the total amount of aluminum nitride and crushed alumina, and contains a total of 60-95 mass% of aluminum nitride and crushed alumina in the thermally conductive silicone composition has excellent moldability, high thermal conductivity and low thermal resistance, can give a cured product also having excellent water resistance, and has good adhesiveness during mounting when used as a heat-dissipating member.
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Inventors:
ITO TAKANORI (JP)
Application Number:
PCT/JP2017/016458
Publication Date:
November 30, 2017
Filing Date:
April 26, 2017
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/22; C08K3/28; C08L83/05; C08L83/06; C09K5/10
Domestic Patent References:
| WO2015155948A1 | 2015-10-15 |
Foreign References:
| JP2009286855A | 2009-12-10 | |||
| JP2012201106A | 2012-10-22 | |||
| JP2010242022A | 2010-10-28 | |||
| JP2005054099A | 2005-03-03 | |||
| JPH0314873A | 1991-01-23 | |||
| JPH03295863A | 1991-12-26 | |||
| JPH06164174A | 1994-06-10 | |||
| JPS6449958A | 1989-02-27 | |||
| JPH06209057A | 1994-07-26 | |||
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| JP4357064B2 | 2009-11-04 | |||
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Other References:
See also references of EP 3467044A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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