Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/149175
Kind Code:
A1
Abstract:
A thermally conductive silicone composition comprising (A) a crosslinked silicone gel, (B) a silicone oil containing neither an aliphatic unsaturated bond nor an SiH group, (C) a thermally conductive filler having an average particle diameter of 0.01-100 μm, the amount of which is 10-2,000 parts by mass per 100 parts by mass of the sum of the (A) and (B) components, and (D) gallium or a gallium alloy having a melting point of -20 to 100°C, the amount of which is 1,000-10,000 parts by mass per 100 parts by mass of the sum of the (A) and (B) components. The thermally conductive silicone composition has a high thermal conductivity and is excellent in terms of applicability and dislocation resistance.
Inventors:
YAMADA KUNIHIRO (JP)
Application Number:
PCT/JP2023/000956
Publication Date:
August 10, 2023
Filing Date:
January 16, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/14; C08K3/01; C08K3/105; C08L83/06
Domestic Patent References:
| WO2021079714A1 | 2021-04-29 | |||
| WO2021206064A1 | 2021-10-14 |
Foreign References:
| JP2005194479A | 2005-07-21 | |||
| JP2021169582A | 2021-10-28 | |||
| JP2007106809A | 2007-04-26 | |||
| JP2018188559A | 2018-11-29 | |||
| JP2013082816A | 2013-05-09 | |||
| JP2014218564A | 2014-11-20 | |||
| JP2021098804A | 2021-07-01 | |||
| JP2002121292A | 2002-04-23 | |||
| US20030113556A1 | 2003-06-19 | |||
| US20210332280A1 | 2021-10-28 | |||
| CN112694869A | 2021-04-23 | |||
| CN112980189A | 2021-06-18 |
Attorney, Agent or Firm:
PATENT ATTORNEY CORPORATION EI-MEI PATENT OFFICE (JP)
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