Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/140006
Kind Code:
A1
Abstract:
The present invention is a thermally conductive silicone composition, characterized by containing: (A) an alkoxysilyl-group-free organopolysiloxane having a kinematic viscosity at 25°C of 10-100,000 mm2/s; (B) an organopolysiloxane having alkoxysilyl groups; (C) one or more thermally conductive fillers selected from amorphous, rounded, and polyhedral fillers having a thermal conductivity of 10 W/m∙K or greater; and (D) hydrophobic spherical silica particles for which D50 in a volume-based grain size distribution is within the range of 0.005-1 μm, D90/D10 is 3 or less, and the average roundness is 0.8-1, the thermally conductive silicone composition moreover being characterized in that the amount of the component (C) is 40-85 vol% of the entire thermally conductive silicone composition. There is thereby provided a thermally conductive silicone composition having excellent compressibility despite being filled with a large amount of thermally conductive filler.
Inventors:
TOYA WATARU (JP)
IWATA MITSUHIRO (JP)
YAMADA KUNIHIRO (JP)
MATSUMURA KAZUYUKI (JP)
IWATA MITSUHIRO (JP)
YAMADA KUNIHIRO (JP)
MATSUMURA KAZUYUKI (JP)
Application Number:
PCT/JP2022/046750
Publication Date:
July 27, 2023
Filing Date:
December 19, 2022
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08K3/22; C08L83/04; C08K3/28; C08K3/36; C08K9/06; C08L83/06; H01L23/373
Domestic Patent References:
| WO2018221662A1 | 2018-12-06 | |||
| WO2016121563A1 | 2016-08-04 |
Foreign References:
| JP2016044213A | 2016-04-04 | |||
| JP2012007057A | 2012-01-12 | |||
| JP2013166667A | 2013-08-29 | |||
| JP2013147600A | 2013-08-01 | |||
| JP2021038366A | 2021-03-11 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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