Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/162636
Kind Code:
A1
Abstract:
The present invention is a thermally conductive silicone composition that contains: (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, at a quantity such that the ratio of (number of Si-H groups) in component (B)/(number of alkenyl groups) in component (A) is 0.5-3.0; (C) 800-20,000 parts by mass of a filler containing one or more types of thermally conductive powder; (D) 20-400 parts by mass of a hydrolyzable organopolysiloxane of formula (1); (E) 0.01-100 parts by mass of an organosilane of formula (2) R2 bSi(OR3)4-b; (F) platinum or a platinum compound at a quantity whereby the amount of platinum atoms is 0.1-500 ppm relative to component (A); and (G) 0.01-1 parts by mass of a reaction controlling agent. Provided by this configuration is a thermally conductive silicone composition in which heat resistance does not deteriorate even under the conditions of high temperature and high humidity, the elastic modulus does not increase even at high temperatures, and voids are not generated.
Inventors:
KUBONO TOKO (JP)
TSUJI KENICHI (JP)
TSUJI KENICHI (JP)
Application Number:
PCT/JP2023/003586
Publication Date:
August 31, 2023
Filing Date:
February 03, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/07; C08K3/013; C08K3/08; C08K3/22; C08K5/5419; C08L83/05; C08L83/06
Domestic Patent References:
| WO2021261147A1 | 2021-12-30 | |||
| WO2020206626A1 | 2020-10-15 | |||
| WO2003052818A1 | 2003-06-26 | |||
| WO2022009486A1 | 2022-01-13 |
Foreign References:
| JP2001139818A | 2001-05-22 | |||
| JP2021514014A | 2021-06-03 | |||
| CN113527893A | 2021-10-22 | |||
| JP2021176945A | 2021-11-11 | |||
| JP2021080311A | 2021-05-27 | |||
| JP2020066670A | 2020-04-30 | |||
| JP2020063380A | 2020-04-23 | |||
| JP2002003718A | 2002-01-09 | |||
| JP2022038407A | 2022-03-10 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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