Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/189699
Kind Code:
A1
Abstract:
The present invention provides: a thermally conductive silicone composition which forms a cured product that has both flexibility at low temperatures and plasma environment degradation resistance; and a heat transfer member which uses this thermally conductive silicone composition. A thermally conductive silicone composition according to the present invention contains a silicone resin component which contains an organopolysiloxane (A) that has an alkenyl group at least at both ends, an organohydrogen polysiloxane (B) that has at least one hydrogen atom bonded to a silicon atom in each molecule and a hydrosilylation catalyst (D), and a thermally conductive filer (C); the organopolysiloxane (A) is a phenyl-modified organopolysiloxane that has at least one phenyl group in each molecule; the organohydrogen polysiloxane (B) is a phenyl-modified organohydrogen polysiloxane that has at least one phenyl group in each molecule; the addition ratio of the thermally conductive filer (C) is 200 to 1,500 parts by weight relative to 100 parts by weight of the silicone resin component; with respect to the hardness of a cured product of this thermally conductive silicone composition, the Asker C hardness (in accordance with JIS K6249) is 70 or less, while the Asker C hardness (in accordance with JIS K6249) after being heated for 24 hours in an environment at 200°C at a vacuum degree of 500 Pa (absolute pressure) is 70 or less; the thermal conductivity of the cured product is 0.5 W/m∙K or more; and the low-temperature change rate of the complex elastic modulus as obtained by dividing the absolute value of the difference between the complex elastic modulus of the cured product at 20°C and the complex elastic modulus of the cured product at -60°C by the complex elastic modulus at 20°C is 700% or less.
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Inventors:
MIZUNO TOMOHISA (JP)
Application Number:
PCT/JP2023/010516
Publication Date:
October 05, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
TAICA CORP (JP)
International Classes:
C08L83/05; C08K3/013; C08L83/07; C09K5/14
Domestic Patent References:
| WO2022049817A1 | 2022-03-10 | |||
| WO2019093295A1 | 2019-05-16 |
Foreign References:
| CN113736266A | 2021-12-03 | |||
| JP2014145024A | 2014-08-14 | |||
| JP2019182980A | 2019-10-24 | |||
| JP2010120979A | 2010-06-03 |
Attorney, Agent or Firm:
HORIKOSHI Somei et al. (JP)
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