Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/203973
Kind Code:
A1
Abstract:
The present invention pertains to a thermally conductive silicone composition comprising components (A)-(D): (A) 100 parts by mass of an organopolysiloxane having a kinematic viscosity of 10-500,000 mm2/s at 25°C; (B) 10-2,000 parts by mass of a thermally conductive filler having an average particle size of 0.01-100 μm; (C) 1,000-20,000 parts by mass of gallium or a gallium alloy having a melting point of -20 to 100°C; and (D) 0.1-100 parts by mass of an alkoxy silane compound represented by general formula (1) R1
aR2
bSi(OR3)4-a-b (in the formula, R1 represents an alkyl group having 6-20 carbon atoms, R2 represents a substituted or unsubstituted monovalent hydrocarbon group having 1-10 carbon atoms, R3 represents an alkyl group having 1-6 carbon atoms, a represents an integer of 1-3, b represents an integer of 0-2, and the sum of a+b is an integer of 1-3). Accordingly, provided is a thermally conductive silicone composition having excellent thermal conductivity and moisture resistance.
Inventors:
YAMADA KUNIHIRO (JP)
Application Number:
PCT/JP2023/012407
Publication Date:
October 26, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/04; C08K3/08; C08K5/5419; C09K5/14
Domestic Patent References:
| WO2016056286A1 | 2016-04-14 | |||
| WO2021210372A1 | 2021-10-21 | |||
| WO2019093052A1 | 2019-05-16 |
Foreign References:
| JP2013010862A | 2013-01-17 | |||
| JP2008031336A | 2008-02-14 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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