Title:
THERMALLY CONDUCTIVE SILICONE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/096000
Kind Code:
A1
Abstract:
Provided is a thermally conductive silicone composition having excellent thermal conductivity, applicability, slippage resistance, and crack resistance. The thermally conductive silicone composition contains (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom and a kinematic viscosity at 25°C of from 10 to 50,000 mm2/s, (B) an organohydrogenpolysiloxane (in an amount to make the molar ratio (Si-H/Si-Vi) of alkenyl groups bonded to silicon atoms (Si-Vi) in component (A) and Si-H groups in component (B) be 1 to 20), (C) an organopolysiloxane having a kinematic viscosity at 25°C of 80,000 mm2/s or more, (D) a silicone oil free of aliphatic unsaturated bonds and Si-H groups and having a kinematic viscosity at 25°C of less than 80,000 mm2/s, (E) a thermally conductive inorganic filler having an average particle size of 3 μm or less, and (F) a thermally conductive inorganic filler having an average particle size of 5 μm or more.
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Inventors:
AKIBA SHOTA (JP)
Application Number:
PCT/JP2023/039217
Publication Date:
May 10, 2024
Filing Date:
October 31, 2023
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C08L83/04; C08K3/013; C08L83/05; C08L83/06; C08L83/07
Domestic Patent References:
| WO2019138991A1 | 2019-07-18 | |||
| WO2022075307A1 | 2022-04-14 | |||
| WO2020203299A1 | 2020-10-08 | |||
| WO2013168291A1 | 2013-11-14 | |||
| WO2022230600A1 | 2022-11-03 |
Attorney, Agent or Firm:
USHIKI & ASSOCIATES (JP)
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