Title:
THERMALLY CONDUCTIVE SILICONE GREASE AND PREPARATION METHOD THEREFOR, AND CHIP ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2022/218091
Kind Code:
A1
Abstract:
The present disclosure provides thermally conductive silicone grease, which is formed by uniformly mixing a plurality of raw material components, the plurality of raw material components comprising: 1 to 50 parts by mass of a base silicone oil; and 60 to 98 parts by mass of a thermally conductive filler; 0.02 to 1 part by mass of a silicone oil cross-linking agent. The present disclosure also provides a preparation method for thermally conductive silicone grease, and a chip assembly.
Inventors:
WANG JIAMING (CN)
ZHENG JINQIAO (CN)
LI SHUAI (CN)
LIU FAN (CN)
ZHENG JINQIAO (CN)
LI SHUAI (CN)
LIU FAN (CN)
Application Number:
PCT/CN2022/081360
Publication Date:
October 20, 2022
Filing Date:
March 17, 2022
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
C08L83/07; C08K7/18; C08K9/04; C08K9/06; C08L83/04; C08L83/05; C09K5/14
Foreign References:
| CN113105744A | 2021-07-13 | |||
| CN111171575A | 2020-05-19 | |||
| CN112625659A | 2021-04-09 | |||
| CN105838079A | 2016-08-10 | |||
| CN111849169A | 2020-10-30 | |||
| US20060100336A1 | 2006-05-11 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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