Title:
THERMALLY CONDUCTIVE SILICONE RUBBER SHEET HAVING THERMALLY CONDUCTIVE ADHESIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2020/162460
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a composite heat-dissipating sheet that has exceptional thermal conductivity and insulation properties and that exhibits sufficient adhesive force, low-heat resistance, reworkability, and reliability of adhesive force for actual application. Furthermore, the purpose of the present invention is to provide an easier process for manufacturing this heat-dissipating sheet. [Solution] The present invention provides a thermally conductive silicone rubber sheet in which there are layered at least one thermally conductive silicone rubber layer having a durometer A hardness of 60-96 and at least one silicone adhesive layer, the thermally conductive silicone rubber sheet being characterized in that: the silicone adhesive layer includes components (a), (c), and (f); and the thermally conductive silicone rubber sheet is a cured product of a silicone adhesive composition that is cured by addition reaction or cured by peroxide. (a) 100 parts by mass of an organopolysiloxane that has at least one alkenyl group bonded to a silicon atom and has a number of phenyl groups bonded to silicon atoms, the number of phenyl groups being 2-20% of the total number of substituents bonded to silicon atoms. (c) 100-800 parts by mass of a thermally conductive filler having an average grain diameter of less than 10 μm, the filler being such that the amount of particles having a grain diameter of 20 μm or higher is 0-3 mass%, and the number of particles having a grain diameter of 40 μm or higher is 0.0-1 mass%. (f) 50-300 parts by mass of a silicone resin that includes R3SiO1/2 units (where R is an optionally substituted C1-10 monovalent hydrocarbon group that does not have an aliphatic unsaturated bond) and SiO4/2 units, the silicone resin being such that the numeric ratio of the R3SiO1/2 units to the SiO4/2 units is 0.5-2.5.
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Inventors:
ITO TAKANORI (JP)
ENDO AKIHIRO (JP)
ENDO AKIHIRO (JP)
Application Number:
PCT/JP2020/004150
Publication Date:
August 13, 2020
Filing Date:
February 04, 2020
Export Citation:
Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
B32B25/08; B32B7/027; B32B25/20; B32B27/00; B32B27/20; C08K3/01; C08K5/14; C08L83/04; C08L83/05; C08L83/07; C09J7/22; C09J7/38; C09J11/04; C09J183/05; C09J183/07; H01L23/36; H01L23/373; H05K7/20
Domestic Patent References:
| WO2014196347A1 | 2014-12-11 | |||
| WO2018070351A1 | 2018-04-19 |
Foreign References:
| JP2018193491A | 2018-12-06 | |||
| JP2016204600A | 2016-12-08 | |||
| JP2009235279A | 2009-10-15 | |||
| JP2006028311A | 2006-02-02 | |||
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| JPS5736302B2 | 1982-08-03 | |||
| JPS56161140A | 1981-12-11 | |||
| JP2001348542A | 2001-12-18 | |||
| JP2009132752A | 2009-06-18 | |||
| JPH06155517A | 1994-06-03 | |||
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| US3220972A | 1965-11-30 | |||
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Other References:
See also references of EP 3922454A4
Attorney, Agent or Firm:
MATSUI Mitsuo et al. (JP)
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