THERMALLY CONDUCTIVE STRUCTURE, ELECTRONIC DEVICE, AND TERMINAL

WIPO Patent Application WO/2024/036525

A1

Provided in the present application are a thermally conductive structure, an electronic device, and a terminal. The thermally conductive structure comprises a thermally conductive portion and an insulation ring, wherein the upper side and the lower side of the thermally conductive portion are at least partially exposed, and the thermally conductive portion may be in contact with heating devices on two sides and a heat dissipator, so as to perform heat conduction; and the insulation ring may protect the thermally conductive portion on the periphery of the thermally conductive portion, such that if the thermally conductive structure is aged, damaged, etc., the internal thermally conductive portion is not easily dispersed. Therefore, the thermally conductive portion may be configured to be a thermally conductive portion made of a material with high thermal conductivity, and specifically, the thermally conductive portion may be a thermally conductive portion made of an electrically conductive material, such that the thermal conductivity of the thermally conductive structure is improved, and the thermally conductive structure is not susceptible to the risk of a short circuit. When the thermally conductive structure is specifically configured, the insulation ring is a closed ring, or the insulation ring has an opening.

FU SANFU (CN)

PCT/CN2022/113134

February 22, 2024

August 17, 2022

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HUAWEI TECH CO LTD (CN)

H05K7/20; H01L23/367; H01L23/373

CN211831630U	2020-10-30
CN101052291A	2007-10-10
CN106455419A	2017-02-22
CN111675880A	2020-09-18
US6392890B1	2002-05-21

TDIP & PARTNERS (CN)

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