Title:
THERMALLY CONTROLLED SELF-ASSEMBLY METHOD AND SUPPORT
Document Type and Number:
WIPO Patent Application WO2006028942
Kind Code:
A3
Abstract:
A support (60) and a method for assembling micro-components (80, 84) to binding sites (62, 64, 66, 68) on the support are provided. The support has a pattern of electrical conductors adapted to conduct electrical energy between binding sites. In accordance with the method, an electrical signal is passed through at least one conductive path including at least one of the conductors so that heat is generated by a portion of each conductive path proximate to the binding sites, a first fluid (72) is applied to the support that is adapted to increase in viscosity when heated, and, a carrier fluid (73) having first micro-components (80) adapted to engage the binding sites is applied to the support. Wherein the heat from the at least one conductive path increases the viscosity of the first fluid in areas (92, 94) proximate to the selected binding sites (62, 66) so as to inhibit first micro-components from engaging the binding sites (62, 66) .
Inventors:
RICKS THEODORE K (US)
SHARMA RAVI (US)
SHARMA RAVI (US)
Application Number:
PCT/US2005/031239
Publication Date:
June 15, 2006
Filing Date:
September 01, 2005
Export Citation:
Assignee:
EASTMAN KODAK CO (US)
RICKS THEODORE K (US)
SHARMA RAVI (US)
RICKS THEODORE K (US)
SHARMA RAVI (US)
International Classes:
H01L21/98; H01L23/34
Foreign References:
| EP1120155A2 | 2001-08-01 | |||
| US5545291A | 1996-08-13 | |||
| US20040068864A1 | 2004-04-15 | |||
| US6527964B1 | 2003-03-04 | |||
| US20020005294A1 | 2002-01-17 | |||
| EP1085568A1 | 2001-03-21 | |||
| US6460966B1 | 2002-10-08 |
Other References:
C. R. BARRY, C. J. HOON, AND H. O. JACOBS: "Approaching Programmable Self-Assembly from Nanoparticle-Based Devices to Integrated Circuits", PROCEEDINGS OF THE FOUNDATIONS OF NANOSCIENCE, UTAH, APRIL 21-23, (2004), April 2004 (2004-04-01), XP002367627
SMITH J S ED - INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS: "HIGH DENSITY, LOW PARASITIC DIRECT INTEGRATION BY FLUIDIC SELF ASSEMBLY (FSA)", INTERNATIONAL ELECTRON DEVICES MEETING 2000. IEDM. TECHNICAL DIGEST. SAN FRANCISCO, CA, DEC. 10 - 13, 2000, NEW YORK, NY : IEEE, US, 10 December 2000 (2000-12-10), pages 201 - 204, XP000988832, ISBN: 0-7803-6439-2
SRINIVASAN U ET AL: "MICROSTRUCTURE TO SUBSTRATE SELF-ASSEMBLY USING CAPILLARY FORCES", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 10, no. 1, March 2001 (2001-03-01), pages 17 - 24, XP001123703, ISSN: 1057-7157
SMITH J S ED - INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS: "HIGH DENSITY, LOW PARASITIC DIRECT INTEGRATION BY FLUIDIC SELF ASSEMBLY (FSA)", INTERNATIONAL ELECTRON DEVICES MEETING 2000. IEDM. TECHNICAL DIGEST. SAN FRANCISCO, CA, DEC. 10 - 13, 2000, NEW YORK, NY : IEEE, US, 10 December 2000 (2000-12-10), pages 201 - 204, XP000988832, ISBN: 0-7803-6439-2
SRINIVASAN U ET AL: "MICROSTRUCTURE TO SUBSTRATE SELF-ASSEMBLY USING CAPILLARY FORCES", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 10, no. 1, March 2001 (2001-03-01), pages 17 - 24, XP001123703, ISSN: 1057-7157
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