Title:
THERMALLY CURABLE RESIN COMPOSITION, INSULATING FILM, INTER-LAYER INSULATING FILM, MULTILAYER WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/103086
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polyphenylene ether (PPE)-based thermally curable resin composition that has excellent high-frequency characteristics and heat resistance reliability (small variation in dielectric tangent (tanδ)), and has excellent resistance to soldering heat. This thermally curable resin composition is characterized by including: (A) polyphenylene ether having an unsaturated double bond at an end and having a number average molecular weight of 800-4500; (B) a phenolic antioxidant having a melting point of 200°C or above; and (C) a thermoplastic elastomer.
Inventors:
SATO JUNYA (JP)
KUROKAWA TSUYOSHI (JP)
YOSHIDA MASAKI (JP)
TERAKI SHIN (JP)
KUROKAWA TSUYOSHI (JP)
YOSHIDA MASAKI (JP)
TERAKI SHIN (JP)
Application Number:
PCT/JP2018/043127
Publication Date:
May 31, 2019
Filing Date:
November 22, 2018
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08J5/18; C08F299/02; H05K1/03
Domestic Patent References:
| WO2015152427A1 | 2015-10-08 | |||
| WO2016175326A1 | 2016-11-03 |
Foreign References:
| JP2015189834A | 2015-11-02 | |||
| JP2017171925A | 2017-09-28 | |||
| JP2013213132A | 2013-10-17 |
Attorney, Agent or Firm:
WATARAI Yusuke (JP)
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