Title:
THERMALLY CURABLE RESIN COMPOSITION FOR LIGHT REFLECTION, SUBSTRATE FOR MOUNTING OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/038772
Kind Code:
A1
Abstract:
A thermally curable resin composition for light reflection according to the present invention comprises an epoxy resin, a hardener, an inorganic filler, and a white pigment, wherein the hardener comprises a tetracarboxylic dianhydride having a melting point of 180-400°C.
Inventors:
INABA YOSHIHITO (JP)
SUTOU HIKARU (JP)
YAMAMOTO TAKASHI (JP)
NARA NAOKI (JP)
SUTOU HIKARU (JP)
YAMAMOTO TAKASHI (JP)
NARA NAOKI (JP)
Application Number:
PCT/JP2019/033794
Publication Date:
March 04, 2021
Filing Date:
August 28, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08G59/42; C08L63/00
Domestic Patent References:
| WO2012111543A1 | 2012-08-23 |
Foreign References:
| CN106752452A | 2017-05-31 | |||
| JP2010189554A | 2010-09-02 | |||
| JP2018070680A | 2018-05-10 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: