Title:
THERMALLY CURABLE RESIN COMPOSITION, RESIN SHEET, AND METAL-BASED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/172387
Kind Code:
A1
Abstract:
A thermally curable resin composition according to the present invention comprises an epoxy resin (A), a hardener (B), and thermally conductive particles (C), wherein the epoxy resin (A) includes a mesogenic skeleton and has a softening point of 60°C or lower. The thermally curable resin composition gives cured objects having 200°C thermal conductivity λ200 of 12.0 W/(m·K) or greater.
Inventors:
ENDO TADASUKE (JP)
KASHINO TOMOMASA (JP)
KASHINO TOMOMASA (JP)
Application Number:
PCT/JP2021/006950
Publication Date:
September 02, 2021
Filing Date:
February 24, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
C08L61/14; C08K3/01; C08L63/00; H05K1/05
Domestic Patent References:
| WO2015141797A1 | 2015-09-24 | |||
| WO2020256005A1 | 2020-12-24 |
Foreign References:
| JP2016094599A | 2016-05-26 | |||
| JP2017028128A | 2017-02-02 | |||
| JP2014214213A | 2014-11-17 | |||
| JP2013254880A | 2013-12-19 | |||
| JP2015193504A | 2015-11-05 | |||
| JP2020031440A | 2020-02-27 |
Other References:
NAGAOKA SHOJI, JODAI TAKUMA, KAMEYAMA YOSHIHIRO, HORIKAWA MAKI, SHIROSAKI TOMOHIRO, RYU NAOYA, TAKAFUJI MAKOTO, SAKURAI HIDEO, IHA: "Cellulose/boron nitride core-shell microbeads providing high thermal conductivity for thermally conductive composite sheets", RSC ADVANCES, vol. 6, no. 39, 29 March 2016 (2016-03-29), pages 33036 - 33042, XP055849842
See also references of EP 4112691A4
See also references of EP 4112691A4
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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