THERMALLY-DETACHABLE SHEET

WIPO Patent Application WO/2013/058054

A1

In order to provide a thermally-detachable sheet that detaches at higher temperatures, this thermally-detachable sheet has a shear bond strength with respect to a silicon wafer of 0.25 kg/5 × 5 mm or larger, at a temperature of 200°C, after said temperature has been maintained for one minute, and a shear bond strength with respect to a silicon wafer of 0.25 kg/less than 5 × 5 mm at any temperature in a range of over 200°C to not more than 500°C, after said temperature has been maintained for three minutes.

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UENDA DAISUKE (JP)
SHIRAKAWA YUSUKE (JP)
HAMAMOTO HIROSHI (JP)
ODA TAKASHI (JP)
TOYODA EIJI (JP)
MATSUMURA TAKESHI (JP)

PCT/JP2012/074143

April 25, 2013

September 21, 2012

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NITTO DENKO CORP (JP)

C08G73/10; C09J7/20; C09J179/08; B32B27/00; B32B27/34

WO2010051212A2

2010-05-06

JP2009074067A	2009-04-09
JPH08311415A	1996-11-26

UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)

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