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Patent Searching and Data


Title:
THERMALLY EXPANDABLE MICROCAPSULES
Document Type and Number:
WIPO Patent Application WO/2022/230994
Kind Code:
A1
Abstract:
The present invention provides: thermally expandable microcapsules which have excellent expandability and high dispersibility, and which enables the achievement of a foam molded body that has good appearance; and an expandable masterbatch and a foam molded body, each of which uses the thermally expandable microcapsules. The present invention provides thermally expandable microcapsules each comprising: a shell; and a volatile expanding agent that is enclosed as a core agent in the shell. The shell contains a compound which has an acetal group.

Inventors:
OBINATA SHUHEI (JP)
WAKIYA TAKESHI (JP)
Application Number:
PCT/JP2022/019389
Publication Date:
November 03, 2022
Filing Date:
April 28, 2022
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08J3/22; B01J13/18; C08J9/14; C08J9/32; C09K3/00
Foreign References:
JP2004150924A2004-05-27
JP2004536172A2004-12-02
JP6825168B12021-02-03
JP2005087956A2005-04-07
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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