Title:
THERMALLY EXPANDABLE MICROSPHERES, HOLLOW PARTICLES, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/140263
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: thermally expandable microspheres which enable the production of hollow particles that can be prevented from the breakage of outer shells thereof or the occurrence of deformation including dimples when a high-pressure load is applied; and a use of the thermally expandable microspheres. Provided are thermally expandable microspheres each comprising an outer shell that comprises a thermoplastic resin, a foaming agent that can be vaporized by heating, and an organic silicon compound, in which the foaming agent is encapsulated in the outer shell, the organic silicon compound is present inside an outer surface of the outer shell and/or on the outer surface of the outer shell, the organic silicon compound has at least one unit selected from a T unit represented by the formula: R1SiO3/2 and a D unit represented by the formula: R2 2SiO2/2, and each of the R1 and the R2 is a monovalent organic group having 1 to 15 carbon atoms.
Inventors:
TAYAGAKI NAOYA (JP)
Application Number:
PCT/JP2023/001244
Publication Date:
July 27, 2023
Filing Date:
January 18, 2023
Export Citation:
Assignee:
MATSUMOTO YUSHI SEIYAKU KK (JP)
International Classes:
B01J13/14; C08F2/18; C08F2/44; C08J9/32; C09K3/00
Foreign References:
| JPS6445468A | 1989-02-17 | |||
| JP2007203164A | 2007-08-16 | |||
| JP2012167286A | 2012-09-06 | |||
| JP2002363537A | 2002-12-18 | |||
| JPS63128075A | 1988-05-31 | |||
| JPH1033971A | 1998-02-10 | |||
| JP2001220510A | 2001-08-14 | |||
| JP2003147207A | 2003-05-21 |
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