Title:
THERMALLY FOAMABLE SHEET AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/039176
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a thermally foamable sheet whereby it is possible to suitably perform bonding in a gap between two adherends. The present invention also relates to a bonding method using such a thermally foamable sheet. This thermally foamable sheet includes a sheet-like substrate and a foamable adhesive layer provided to one or both surfaces of the sheet-like substrate. In addition, the foamable adhesive layer is at least one of the outermost layers of the thermally foamable sheet and contains an epoxy resin, a curing agent, a thermoplastic resin, and a foaming agent. The arithmetic mean roughness Ra in the outermost surface of the foamable adhesive layer is 0.4 μm or more.
Inventors:
SHIRAIWA HIROYUKI (JP)
Application Number:
PCT/JP2021/030089
Publication Date:
February 24, 2022
Filing Date:
August 18, 2021
Export Citation:
Assignee:
NIKKAN IND (JP)
International Classes:
B32B27/12; C09J7/29; C09J7/35; C09J11/06; C09J11/08; C09J163/00
Domestic Patent References:
| WO2019031429A1 | 2019-02-14 |
Foreign References:
| JP2015054935A | 2015-03-23 | |||
| JPS5712082A | 1982-01-21 | |||
| JP2018021203A | 2018-02-08 | |||
| JP2020076059A | 2020-05-21 | |||
| JP2021155495A | 2021-10-07 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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