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Patent Searching and Data


Title:
THERMALLY PEELABLE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2021/192319
Kind Code:
A1
Abstract:
In this thermally peelable adhesive tape having a thermally expandable adhesive layer containing thermally expandable particles and an adhesive component, the maximum expansion temperature of the thermally expandable particles is set to 170°C or higher; and for a dynamic viscoelastic measurement (temperature range of -60°C to 300°C, temperature rising speed of 10°C/minute, and frequency of 10 Hz) of the adhesive component, (1) the tanδ of the maximum expansion temperature of the thermally expandable particles is set to 0.120 or less, and (2) the storage modulus G' at 170°C is set to at least 30,000 Pa, whereby a thermally peelable adhesive tape can be obtained which can be suitably used in a pressing step for a long time at normal temperature or at high temperature, has a prominent reduction in the adhesiveness of the adhesive layer when further heated after use in the pressing step, and can be easily peeled off without residual paste remaining on an adherend.

Inventors:
TSUCHIYA YASUSHI (JP)
IWAMOTO TARO (JP)
KUDO EIICHI (JP)
Application Number:
PCT/JP2020/014413
Publication Date:
September 30, 2021
Filing Date:
March 27, 2020
Export Citation:
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Assignee:
TERAOKA SEISAKUSHO KK (JP)
International Classes:
C09J11/08; C09J7/25; C09J7/38; C09J201/00; C09K3/00
Foreign References:
JP2016155919A2016-09-01
JP2013177549A2013-09-09
JP2017002190A2017-01-05
JP2013076031A2013-04-25
US20150299521A12015-10-22
Attorney, Agent or Firm:
ISHIBASHI, Masayuki et al. (JP)
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